Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents

US6884833B2 · kind B2 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• Theary Chheang · Bloomington, US
• Andrew M. Hine · Windom, US
• Mark W. Muggli · West St. Paul, US
• Susan C. Noe · Windom, US
• Patricia M. Sanft · St. Paul Park, US
• William J. Schultz · North Oaks, US
• Robert D. Taylor · Boulder, US
• Stanley Tead · Windom, US

Key dates

• Filing date: Jun 29, 2001
• Grant date: Apr 26, 2005
• Expiry date: Oct 21, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P20/582
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.