Patent · US Expired

Polyolefin based resin film and a composition for a polyolefin type resin film

US6884836B2 · kind B2 · utility

0Cited by
1References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 2002
Grant dateApr 26, 2005
Priority date
Expiry dateSep 4, 2022

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J2323/12
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

To provide a polyolefin based resin film of high elastic modulus and a composition for producing a polyolefin based resin film of high elastic modulus. The polyolefin based resin film is characterized in that a polyolefin [A] having a weight average molecular chain length of 2850 nm or more and a polyolefin wax [B] having a weight average molecular weight of 700 to 6000 have been compounded in a ratio of [A]/[B]=90/10 to 50/50 (by weight) as the resin component, and 10 to 300 parts by weight of inorganic fillers have been added to 100 parts by weight of the resin component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.