Constructing of an electronic assembly having a decoupling capacitor
US6884939B2 · kind B2 · utility
17Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jun 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder balls are soldered to electric lands on the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.