Active matrix substrate, method of manufacturing the same, and display device
US6885030B2 · kind B2 · utility
41Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jun 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active matrix substrate comprises a substrate, a thick-film adhesive pad made of organic resin, provided on the substrate and including, at least at a part of a side face thereof, an inclined region having a first contact angle smaller than 90 degrees to the main face of the substrate, a thin-film active element provided on the thick-film adhesive pad, and a thin-film interconnection line connected to the thin-film active element and extending onto the substrate via the inclined region, a film thickness of the thick-film adhesive pad being four or more times that of the thin-film interconnection line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.