Semiconductor copper bond pad surface protection
US6885104B2 · kind B2 · utility
1Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | May 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.