Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
US6885522B1 · kind B1 · utility
8Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2000 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Apr 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.