Apparatus for monitoring a solder wave
US6885613B1 · kind B1 · utility
1Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2000 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | May 26, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is disclosed apparatus for monitoring a solder wave comprising a board of insulating material simulating a printed circuit board, an array of spaced electrical contact elements on the underside of the board across the entire width thereof, means for measuring the dwell time of each contact in the wave as the board is conveyed over the wave, and means for displaying the measured dwell times to show the contact area and time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.