Radial heat sink with helical shaped fins
US6886627B2 · kind B2 · utility
12Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Jun 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly includes an integrated circuit (e.g., a processor) mounted on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled to the integrated circuit. The radial heat sink includes a core having an outer surface, and a plurality of helical fins that extend from the outer surface of the core. The electronic assembly may include a fan positioned near the heat sink. The appropriate angle for the helical fins relative to the longitudinal axis of the heat sink depends in part on the direction of the airflow that is produced by the fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.