Method of thermosonic wire bonding process for copper connection in a chip
US6886735B2 · kind B2 · utility
1Cited by
10References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2003 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | May 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200 Å. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.