Patent · US Expired

Method for fabricating printed-wiring substrate

US6887512B2 · kind B2 · utility

1Cited by

6References

5Claims

0Family size

Assignee

NGK SPARK PLUG CO., LTD. · US

Inventors

Hisashi Wakako · Komaki, JP
Masahiro Iba · Ebeye, US
Kazuhisa Sato · Ebeye, US
Kazuo Kimura · Houfu, JP

Key dates

Filing date	Aug 9, 2002
Grant date	May 3, 2005
Priority date	—
Expiry date	Aug 9, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49156
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.