Residue and scum reducing composition and method
US6887654B2 · kind B2 · utility
3Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Jul 10, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/322
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A composition and method to reduce or to prevent residue and scum formation on a substrate or in a solution. The composition contains an aromatic alkoxylate in combination with a polyol or ether or ester of a polyol. The composition also reduces or prevents foam formation such as in developing processes in the manufacturing of printed wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.