Modular packaging arrangements and methods
US6888064B2 · kind B2 · utility
5Cited by
13References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2002 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Dec 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to chip packaging and methods of packaging and, more particularly, to compact packaging of chips and methods thereof in electronic environments that minimize undesired electronic effects, promote speed, and enhance packaging versatility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.