Patent · US Expired

Semiconductor device and fabrication process therefor

US6888191B2 · kind B2 · utility

6Cited by
13References
23Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 24, 2001
Grant dateMay 3, 2005
Priority date
Expiry dateSep 24, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D86/201

Abstract

A semiconductor device comprises: a semiconductor substrate of a first conductivity type; a first electrode provided on the semiconductor substrate with the intervention of a gate insulation film; a second electrode provided at least on the first electrode with the intervention of an intermediate insulation film; and a pair of impurity regions of a second conductivity type provided in a spaced relation in the semiconductor substrate, at least one of the impurity regions comprising a low concentration impurity region, an intermediate concentration impurity region and a high concentration impurity region sequentially arranged in this order from a region located underneath the first electrode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.