Method and device for cooling/heating die during burn in
US6888363B1 · kind B1 · utility
3Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for burn-in testing of integrated circuits employs a cooling module with an aperture that accommodates a standard size holder for various chips, the holder being placed in the mouth of the aperture, in contact with a flexible seal. When the module is raised to make contact from below with a socket on a test board, the seal confines the cooling fluid and contacts on the upper surface of the holder are pressed against a set of corresponding contacts on the test board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.