Manufacturing method of electronic circuit including multilayer circuit board
US6889431B2 · kind B2 · utility
3Cited by
4References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 21, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Dec 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.