Spray cooling system
US6889515B2 · kind B2 · utility
21Cited by
45References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Feb 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.