Method and apparatus for determining processing size of bonding material
US6889738B2 · kind B2 · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2003 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Sep 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.