Heat pipe having a wick structure containing phase change materials
US6889755B2 · kind B2 · utility
78Cited by
43References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2003 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | May 31, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.