Transfer apparatus for arraying small conductive bumps on substrate and/ or chip
US6889886B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 25, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Jun 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.