Fluorinated surfactants for aqueous acid etch solutions
US6890452B2 · kind B2 · utility
12Cited by
19References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 8, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31111
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Novel aqueous, acid etch solutions comprising a fluorinated surfactant are provided. The etch solutions are used with a wide variety of substrates, for example, in the etching of silicon oxide-containing substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.