Photodetector matrix with pixels isolated by walls, hybridized onto a reading circuit
US6891242B2 · kind B2 · utility
8Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2003 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Apr 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/93
Abstract
An array of photodetectors intended to be hybridized on a readout circuit and fabricated from a wafer in semiconductor material. The wafer is divided into pixels, the pixels being separated from one another by walls formed crosswise over the entire thickness of the wafer, the hybridization surface having connection pads enabling hybridization of the photodetector array to the readout circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.