Semiconductor device with protrusions
US6891254B2 · kind B2 · utility
7Cited by
5References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Jan 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die pad 14 with a semiconductor chip 32 mounted thereon is placed between first and second molding dies 40, 42 such that the die pad 14 is supported above the second molding die 42. A sealant 30 is then injected between the first and second molding dies 40, 42 to seal the semiconductor chip 32. Part of the die pad 14 has one or more protrusions 16 projecting in the direction of the second molding die 42. Injecting the sealant 30 presses the protrusions 16 against the second molding die 42 and seals the semiconductor chip 32.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.