RF transition for an area array package
US6891266B2 · kind B2 · utility
18Cited by
16References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09618
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.