Patent · US Expired

Mold clamping apparatus and mold clamping method

US6892560B2 · kind B2 · utility

5Cited by
10References
29Claims
0Family size

Assignees

Inventors

Key dates

Filing dateJun 15, 2001
Grant dateMay 17, 2005
Priority date
Expiry dateMay 27, 2023

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4992
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A mold clamping apparatus includes a frame including a holding portion for holding a mold and an open portion allowing the mold to be inserted into/taken out from the holding portion in a direction of the longer side of the mold, a mold moving device for moving the mold to insert/take out the mold into/from the holding portion through the open portion in the frame, and a mold opening/closing device for opening/closing the mold located outside the frame. This mold clamping apparatus is capable of holding the mold securely in a closed state resisting a pressure acting to open the mold and allows reduction of energy consumption, equipment maintenance cost, production cost, and the size thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.