Cutting element having a substrate, a transition layer and an ultra hard material layer
US6892836B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2000 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Jan 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S76/12
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A non-uniform interface is formed between a polycrystalline ultra hard material layer and a cemented tungsten carbide substrate, or a polycrystalline ultra hard material layer and a transition layer, or a transition layer and a substrate of a cutting element. A first sheet made from an intermediate material is formed and embossed on one face forming a non-uniform pattern raised in relief on the face. The embossed sheet is placed on a face of a presintered substrate. An ultra hard material sheet is formed and embossed, forming a non-uniform face complementary to the non-uniform face on the sheet of intermediate material. The ultra hard material sheet is placed over the intermediate material sheet so that the complementary faces are adjacent to each other. The assembly of substrate and sheets is sintered in a HPHT process. The sintering process causes the first sheet to become integral with the substrate and results in a substrate having a non-uniform cutting face onto which is bonded a polycrystalline ultra hard material layer. Embossed transition material sheets may be employed between the ultra hard material sheet and the first sheet to form transition layers with uniform or non-u…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.