Polishing pad conditioner and chemical-mechanical polishing apparatus having the same
US6893336B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 30, 2003 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Sep 25, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad conditioner for a chemical-mechanical polishing apparatus includes a conditioning plate having a first recess and a holder having a second recess. The first recess is formed on the upper face of the conditioning plate, and the second recess is formed on the bottom face of the holder. A first filling member having a specific gravity smaller than that of the conditioning plate fills up the first recess, and a second filling member having a specific gravity smaller than that of the holder fills up the second recess. Therefore, the weight of the polishing pad conditioner can be reduced, and the durability and service life of an air bladder that adjusts the height of the polishing pad conditioner can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.