Double-side lamination system
US6893521B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2004 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Mar 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a double-side lamination system having a thermocompression bonding device for laminating laminate films on both surfaces of a card by applying heat and pressure using a pair of heat rollers, a temperature measurement device for measuring temperatures of the heat rollers are provided, and whether the lamination system is in a double-side lamination mode in which laminations are carried out on both surfaces of the card, or in a single-side lamination mode in which lamination is carried out on one of the surfaces of the card, is automatically distinguished by comparing measured temperatures of the heat rollers at a predetermined time after turn-on of the power of the system with a predetermined reference temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.