Layered resin molding and multilayered molded article
US6893729B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2001 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Sep 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31743
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer.The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.