Method and device for cutting a flat workpiece that consists of a brittle material
US6894249B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Apr 4, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/091
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An arrangement for cutting a flat workpiece includes a drive unit for generating a relative movement between the focused laser beam (2) and the workpiece (1). The laser beam induces a thermomechanical stress in the workpiece along the cutting line. A scoring tool (7) generates an initial score at the start of the cutting line. A “flying” scoring is provided wherein a unit (5, 6, 8) moves the scoring tool (7). The unit is coupled in a controlled manner to the cutting movement of the laser beam (2) so that the scoring tool (7) can be brought into a short-time scoring working engagement with the workpiece (1) at the start of the cutting movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.