Structure of light-emitting diode array module
US6894315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2003 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Feb 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49175
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a structure of light-emitting diode (LED) array module, comprising a substrate, a carrier substrate, a chip, a driving circuit chip, and a plurality of metal lines. The carrier substrate is on top of the substrate, and the top surface of the carrier substrate is divided into a first area and a second area. The chip is attached to the first area of the carrier substrate, and further comprising a light-emitting component array and a pad array. The driving circuit chip is attached to the second area of the carrier substrate, and further comprising a pad array and a pad. The metal lines are for electrically connecting the substrate to the driving circuit chip, and the chip to the driving circuit chip, respectively. The present invention can reduce the manufacturing cost, and improve the yield rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.