Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology
US6894385B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Nov 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package is disclosed. The integrated circuit package includes a package substrate having a top and a bottom. Further, the integrated circuit package includes a plurality of bypass capacitors coupled to the bottom of the package substrate without a cavity. Moreover, the integrated circuit package includes an array of solder balls formed on the bottom of the package substrate. The array of solder balls facilitates surface mounting to a printed circuit board assembly. Also, the solder balls provide sufficient space between the printed circuit board assembly and the bypass capacitors. In an embodiment, the package substrate is an organic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.