Semiconductor device with capacitor
US6894396B2 · kind B2 · utility
7Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Jul 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a carrier substrate, an integrated circuit chip mounted on the carrier substrate via bumps, and a capacitor provided to stabilize operation of the integrated circuit chip at high frequencies. In the semiconductor device, the capacitor is electrically connected to pads on bottom of the integrated circuit chip, and the capacitor is provided to have a height on the carrier substrate that is smaller than or equal to a height of the bumps on the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.