Micromagnetic latching switch packaging
US6894592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2002 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Jul 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2050/007
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever. An electromagnet is attached to the inner surface or an outer surface of the cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.