Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same
US6895026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2001 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Apr 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/405
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser stack apparatus 1 comprises three semiconductor lasers 2a to 2c, two copper plates 3a and 3b, two lead plates 4a and 4b, a supply tube 5, a discharge tube 6, four insulating members 7a to 7d, and three heat sinks 10a to 10c. Here, the heat sink 10a to 10c is formed by a lower planar member 12 formed with a supply water path groove portion 22, an intermediate planar member 14 formed with a plurality of water guiding holes 38, and an upper planar member 16 formed with a discharge water path groove portion 30 which are successively stacked one upon another, whereas their contact surfaces are joined together. The heat sink 10a to 10c is provided with pillar pieces 24 for connecting the bottom face of supply water path groove portion 22 and the lower face of intermediate planar member 14 to each other, and pillar pieces 32 for connecting the bottom face of discharge water path groove portion 30 and the upper face of intermediate planar member 14 to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.