Crack propagation stops for dicing of planar lightwave circuit devices
US6895133B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Nov 26, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/13
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
One aspect of the present invention relates to a method of dicing a substrate containing a plurality of non-rectangular shaped optical integrated circuits, involving forming stop cracks in the wafer, each stop crack adjacent and substantially parallel one of the non-rectangular shaped optical integrated circuits, and cutting the substrate in a curvilinear manner substantially parallel to a stop crack. Another aspect of the present invention relates to an optical structure containing a substrate; a plurality of non-rectangular shaped optical integrated circuits on the substrate, each non-rectangular shaped optical integrated circuit having an active region; and at least one stop crack positioned adjacent each non-rectangular shaped optical integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.