Chemical mechanical polishing optical endpoint detection
US6896588B2 · kind B2 · utility
1Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2003 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Light is incident on a semiconductor wafer polish surface and an adjacent reference surface (80). The reflected light from each surface is detected by a detector (35) positioned beneath the surfaces. The signals derived from each source of reflected light is analyzed in a electronic system (37) and an endpoint for a chemical mechanical polish process is determined as a function of both signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.