Radiating enclosure
US6897373B2 · kind B2 · utility
8Cited by
19References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2002 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Dec 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/38
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated radiating enclosure is disclosed. The enclosure housing is formed from a dielectric material with a radiating element formed on the exterior surface of the housing and a groundplane material formed on the interior of the housing. The groundplane provides EMI shielding for the enclosed electronics. The three antenna elements are directly connected to the circuitry of a transceiver system, thereby integrating the transceiver antenna components directly into the transceiver enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.