Ball grid array resistor network
US6897761B2 · kind B2 · utility
8Cited by
31References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2002 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Jan 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.