Radiator structure for a computer device
US6898081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2003 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Nov 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radiator structure has a circuit board, at least one conductive plate, a radiator board and at least two lock attachments, and reduces the entire radiator structure size to permit micro miniaturization designs and increase the space efficiency without affecting cooling efficiency. The radiator board has a deforming section, which undergoes resilience deformation facing the circuit board to absorb a contact pressure generated between the radiator board, the conductive plate and the microprocessor chip. Use of a spring to absorb the contact pressure is thus not required, which decreases the number of parts and manufacturing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.