Package map data outputting circuit of semiconductor memory device and method for outputting package map data
US6898133B2 · kind B2 · utility
2Cited by
2References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 26, 2002 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Oct 11, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/48
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A package map data outputting circuit of a semiconductor memory device embedded with a test circuit and a method for the same are provided. To improve the reliability of package map data and easily output a greater amount of the package map data, the package map data is stored to package map data registers at the wafer level and then output through the test circuit at the package level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.