Gas laser machining apparatus
US6898220B2 · kind B2 · utility
0Cited by
2References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Jun 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/134
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a gas laser machining apparatus based on a pulse laser oscillation, a mis-pulse-preventing pulse, viz., a preparatory pulse component whose energy is below the threshold value of a laser oscillation, is located prior to a first pulse of discharging power pulses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.