Shock-resistant backplane utilizing infrared communication scheme with electrical interface for embedded systems
US6898378B1 · kind B1 · utility
1Cited by
34References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/11
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Infrared communications scheme for use in an embedded system. According to a preferred embodiment, the invention comprises the use of an infrared communications scheme, according to IrDA protocol, which is utilized to transmit and receive data via an electrical interface between circuit cards housed within an enclosed, embedded system. Preferably, each respective circuit card is provided with a digital tri-stateable transmitter element and a digital receiver to respectively transmit and receive data. The systems and methods of the present invention provide increased reliability than prior-art systems and methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.