High speed, high density interconnection device
US6899550B2 · kind B2 · utility
13Cited by
33References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2004 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Feb 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.