Printing with differential adhesion
US6899775B2 · kind B2 · utility
17Cited by
6References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2003 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | May 8, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to the printing of a substrate having a pre-printed “print pattern” with a “design layer” of ink where there is differential adhesion within and without the print pattern. The print pattern is receptive to an ink, and the design layer ink forms a durable image material with good bond to the print pattern, but the ink does not form a durable image material on the portions of the substrate outside the print pattern. The design layer ink is a UV-curable ink, and the print pattern may have a higher surface energy than the portions of the substrate outside the print pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.