Solder-bearing wafer for use in soldering operations
US6900393B1 · kind B1 · utility
9Cited by
8References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Dec 19, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder bearing—bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and second surface, opposing the first surface. The first surface has grooves (115, 117) formed therein and includes length of solder (130) dispersed within groove. Upon heating the solder and placement of the wafer between the first and second devices, the two devices are connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.