Electric optical apparatus using a composite substrate formed by bonding a semiconductor substrate and manufacturing method of the same, projection display, and electronic instrument
US6900861B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2002 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Sep 14, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136227
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides an electric optical apparatus and a manufacturing method thereof, in which, when forming a contact hole by wet etching to control an electric potential of a light-shielding layer, etching liquid does not infiltrate the bonding boundary between a supporting substrate and a semiconductor substrate. An electric optical apparatus includes a first insulator layer formed on an underside of a semiconductor layer, a second insulator layer formed on a side lower than the first insulator layer, a light-shielding layer formed between the first insulator layer and the second insulator layer, and a contact hole passing through at least the first insulator layer to the light-shielding layer. The light-shielding layer is located at a position upper than that of the bonding boundary between a supporting substrate and a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.