Method of patterning and fabricating poled dielectric microstructures within dielectric materials
US6900928B2 · kind B2 · utility
4Cited by
22References
149Claims
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Key dates
| Filing date | Mar 19, 2002 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Dec 10, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/3558
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of patterning and fabricating poled dielectric microstructures in dielectric materials comprising the following steps. A poled dielectric microstructure within a dielectric material is provided. The poled dielectric microstructure is then segmented into a plurality of independent sub-structures. The poled dielectric microstructures are then fabricated within each of the plurality of independent sub-structures. Additional processes and a novel poling setup for improving and implementing this patterning and fabrication method are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.