Patent · US Expired

Package structure for a hybrid optical module and method of producing the same

US6901092B2 · kind B2 · utility

0Cited by

3References

6Claims

0Family size

Assignee

Pioneer Corporation · JP

Inventors

Masaki Okayasu · Tokyo, JP
Shinnosuke Fukuda · Saitama, JP
Hirofumi Tanaka · Saitama, JP

Key dates

Filing date	Dec 21, 2000
Grant date	May 31, 2005
Priority date	—
Expiry date	Jul 17, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A resin package 1 is hollowed in order to house components of a hybrid optical module. Laser devices 7 and 8 are die-bonded to metal frames 2 and 3, respectively. Ends of the metal frames are bent, and then embedded into the resin package 1 as in-resin bent portions 4, 5, and 6. In a frame led-out portion 10, portions of the metal frames 2 and 3 are led out to the outside of the resin package 1. The led-out portion 10 is made in contact with a metal plate, an aluminum die cast member, or the like which is outside the package, whereby the heat radiation effect is improved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.