Injection molding distribution manifold having improved uniformity of manifold block temperatures
US6902119B2 · kind B2 · utility
2Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2003 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Apr 17, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/2738
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Auxiliary end heating devices on an elongated, heated hot melt distribution manifold body assist in maintaining uniform temperatures throughout all portions and passageways of the manifold body. The heating devices preferably take the form of thick film electrical resistive heaters of plate-like construction. The end heaters are on their own control circuit separate and apart from the circuit for other heaters for remaining portions of the manifold body. Special isolating slots are formed in lower corners of the manifold body between supporting standoffs and overhead melt passageways in the manifold body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.