Fluid ejection device adherence
US6902260B2 · kind B2 · utility
5Cited by
5References
52Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2003 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Aug 12, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1623
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Fluid-ejection devices capable of ejecting fluid onto media and methods for their manufacture are provided. One embodiment includes adhering a fluid-ejecting substrate of the fluid-ejection device to a carrier of the fluid-ejection device by drawing an adhesive between the fluid-ejecting substrate and the carrier using capillary action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.